A participant with over five years of experience in BIM modeling and architectural design joined the adaptation program and continued to receive career counseling afterward. With tailored advice and support on resume writing, interviews, and workplace culture, they clarified their career direction and job search strategy. They eventually secured a position as a 3D modeling and fire protection planning engineer at a local engineering company.
網站標題
外籍碩博士在臺就業媒合資訊平台 Insight Careers Taiwan
News 最新消息
VIEW MORENew Jobs 最新職缺
VIEW MORE
Sr. Switch Hardware Design Engineer - Work location: Xinzhuang
優達科技股份有限公司
- 新北市新莊區
1. Circuit Design(OrCAD) 2. Layout Review(Allegro) 3. HW Validation and Trouble Shooting 4. BOM Maintenance and P/N Application 5. New Technology Study and Introduction 6. Design Proposal Integration 7. Schedule Control 8. Cross-sectional Collaboration
Number of clicks: 3

Advanced Process Development Engineering Deputy Manager/Manager_Hsinchu_06842
緯創資通股份有限公司
- 新竹市
Please submit your application through the Wistron official website: https://jobs.wistron.com/#/app. Resumes submitted through the website will be reviewed first. Please register an account with your personal email address so we can contact you later. Thank you! 1. Advanced process technology development and implementation; 2. Cross-departmental technical collaboration and problem solving; 3. Industry development trend research and internal improvement promotion.
Number of clicks: 0

PKG Engineer (I7S1)
聯詠科技股份有限公司
- 新竹市
[Product Line Description] Evolution Video Display Emerging Displays: 1. Gaming monitor controller for LCD, OLED and Mini-LED. Professional esports monitors, ultra-immersive curved screens, immersive gaming experience 2. Public display controller for LCD and Micro/Mini-LED. Large commercial displays, ultra-narrow bezel video walls, electronic whiteboards 3. Electronic Vehicle Display Controller. AR/2D HUD (head-up display), automotive high-speed display interface 4. Advanced Projector Controller. Low-latency gaming projectors, short-throw projectors, floating image displays [Work Description] 1. LQFP, PBGA, TFBGA, FCBGA, FCCSP, CoWoS substrate routing design 2. 2.5D IC substrate routing design 3. Adjust ballout & pad to meet package design requirements 4. Evaluate routing methods for various packages and multi-die SIP placement 5. Substrate and PCB layout review 6. Package thermal analysis 7. IC Power and System thermal analysis [Prerequisites] 1. Familiarity with Cadence APD 1. Proficient in software, DRC rule settings, and smooth operation of design software for package design layout. 2. 3+ years of BGA package design experience, familiar with various package and substrate design. Experience with CoWoS/RDL/Wirebond package design is preferred. 3. Bachelor's degree or above in electrical or electronics related engineering, preferably with SI/PI knowledge. 4. Familiar with package substrate layout (DRC, LVS) processes and related software operations. 5. Active, cross-departmental communication and coordination skills, and a strong sense of responsibility.
Number of clicks: 0


















